
Deep Reactive Ion Etch Micro-Gyroscope Temperature Compensation with On-Chip Thermal State Estimators
On-chip thermal state estimators eliminate MEMS gyro dynamic bias drift by using drive resonance to calculate mass temperature in real time.

On-chip thermal state estimators eliminate MEMS gyro dynamic bias drift by using drive resonance to calculate mass temperature in real time.

Wafer-level residual stress gradients induce asymmetric die warpage that relaxes over time, causing dynamic calibration matrices to suffer severe cross-axis drift.

Real-time matrix correction using on-die piezoresistive strain arrays reduces board flexure induced zero-rate drift in automotive MEMS gyroscopes below 0.02 deg/s.
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